Amkor Technology, Inc.
Amkor Technology, Inc. provides semiconductor assembly and test services in the United States. It offers packaging solutions, including leadframe and laminate packages using wirebond and flip chip formats. The company assembles Three-dimensional (3D) packages in which the individual chips are stacked vertically to provide space on the system board; multi-chip modules used in cell phones and other handheld end-products; chip scale packages; flip chip and wafer level packages in which the semiconductor die is connected directly to the package substrate or system board; and packages for micro-electromechanical system devices that are used in automotive, industrial, and personal entertainment markets.
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